Chuan Ai Lu Engstrom Memorial Scholarship

Scholarship Sponsored by PCB Solutions

Overview

PCB Solutions is sponsoring the Chuan Ai Lu Engstrom Memorial Scholarship Contest to support college students pursuing higher education and careers related to electronic design, engineering, manufacturing, and related fields. The award honors the legacy of a former employee and aims to encourage thoughtful vision and entrepreneurship in the global economy. The program is ongoing and awards multiple winners each year.

Description: The contest solicits an 800+-word essay on the future of electronic design, engineering, and manufacturing in the global economy, accompanied by a short bio video or written summary and required submission paperwork.

• Scholarship supports students engaged in fields tied to electronics and manufacturing.
• Submissions center on a forward-looking essay and a brief personal bio or video.
• Program is ongoing with multiple awards annually.

History of the Award

The scholarship was established in memory of Chuan Ai Lu Engstrom, who passed away in 2014 after a battle with uterine cancer. Ai emigrated from China, became an American citizen, and was known for her enthusiasm for learning English and her optimistic, kind nature. The award preserves her legacy by supporting students who demonstrate vision, resilience, and a commitment to learning.

History of the Award: Named for Chuan Ai Lu Engstrom, the scholarship commemorates her life, values, and dedication to education.

• Created to honor the memory and values of Chuan Ai Lu Engstrom.
• Recognizes optimism, learning, and community-mindedness.
• Maintains a personal connection to PCB Solutions and its employees.

Eligibility

Any current, full-time student enrolled at an accredited college or university in the United States with a minimum cumulative GPA of 2.5 is eligible to apply. There is no age requirement. Applicants should be prepared to verify enrollment and academic standing as part of the application process.

Eligibility: Full-time students at accredited U.S. institutions with a 2.5+ cumulative GPA; no age restriction.

• Open to full-time students at accredited U.S. colleges and universities.
• Minimum cumulative GPA requirement: 2.5.
• No age limitation for applicants.

How to Apply

Applicants must submit an original essay of at least 800 words addressing the topic: "Discuss your vision of electronic design, engineering and manufacturing in the global economy." Supporting materials may include descriptions of relevant experience, entrepreneurial ideas, and references to reputable sources. In addition to the essay, submit a short bio video or a brief written summary explaining your background, why education matters to you, and how you would use the scholarship funds. All materials, including a completed Content Contribution Agreement and full contact information (major and expected graduation date), should be emailed as Word or PDF attachments to [email protected].

Application: Submit the 800+ word essay, a short bio video or written summary, the Content Contribution Agreement, and contact/academic details by email.

• Essay must be at least 800 words and focused on the specified topic.
• Include a short bio video or written summary and necessary forms.
• Email submissions as Word or PDF to the provided contact address.

Deadline and Timeline

Essay submission deadlines align with the academic calendar: submissions for the fall semester are due in August, and submissions for the spring semester are due in December. The scholarship program runs continuously with two award cycles each calendar year, corresponding to those semesters. Applicants should plan to submit well before the stated monthly deadlines to ensure committee review.

Application Timeline: Fall submissions are due in August; spring submissions are due in December; two award cycles occur each year.

• Fall deadline: August (winner announced mid-August cycle).
• Spring deadline: December (winner announced mid-December cycle).
• Program operates on two cycles per year.

Selection Process and Notification

Essays and accompanying materials are reviewed by the PCB Solutions Scholarship Committee, which evaluates submissions on clarity of vision, relevance to the topic, supporting experience or research, and overall quality. Winners are announced publicly and notified directly by email. Published winners can be viewed on the Scholarship Award Winners page of the PCB Solutions website.

Selection Process: Committee review determines winners based on essay quality, relevance, and supporting material; winners are posted online and contacted by email.

• Committee-based review of all eligible submissions.
• Winners are announced publicly and notified via email.
• Past and current winners are listed on the Scholarship Award Winners page.

Award Details

The selected recipient will receive a $1,000 scholarship awarded as a one-time payment credited to the recipient’s enrolled institution for academic expenses. The scholarship is non-renewable and can only be received once per recipient. Funds are applied to tuition or other school-related charges as directed by the recipient’s institution.

Award Value: $1,000 paid to the recipient’s enrolled school for academic costs; non-renewable and limited to one semester cycle and a single lifetime award per recipient.

• Award amount: $1,000 paid directly to the school.
• Funds must be used for school-related expenses and are credited by the institution.
• Non-renewable; each recipient may receive the scholarship only once in their lifetime.